Postdoctoral position in the Department of Mechanical Engineering at the University of Hong Kong.

Scholarship: fully-funded
Degree: Ph.D
Nationality: International Students
Location: Hong Kong
Application deadlines: Open


Scholarship Description:

Dr LIN received BS and MS degrees in Engineering Mechanics from Tsinghua University. He then obtained an MS degree in Applied Mathematics from Brown University, followed by a Ph.D. degree in Solid Mechanics. His current research interests include collective cell migration, tissue morphogenesis, cytoskeletal mechanics, mechano-regulation/phenotyping of cells, neuronal mechanics, and bio-microfluidics. A number of PhD graduates from Dr LIN’s group have become faculty members in top universities in China, such as the University of Science and Technology of China and the Harbin Institute of Technology. For more information, please visit http://meweb.hku.hk/~ylin/.

The University of Hong Kong (HKU) is an English-language, public research university in Hong Kong. Founded in 1911, it traces its origins to the Hong Kong College of Medicine for Chinese, which was established in 1887. It is the oldest tertiary institution in Hong Kong. HKU was also the first university founded by the British in East Asia.

In 2023, HKU was ranked 21st internationally by QS and 31st internationally by Times Higher Education. It has been ranked as the most international university in the world and one of the most prestigious universities in Asia.

 Available Subjects:

  • Neural Cell Mechanics and Signal Transmission

Eligibility criteria:

  1. Applicants should have a PhD in biophysics, biomedical engineering, neuroscience or related disciplines. Strong experimental experience in nanobiotechnology, neuronal biology and microfabrication is preferred.

Application Procedure:

Interested candidates should contact Dr LIN ([email protected]) with an expected start date and a CV detailing academic and research achievements. Applications will be reviewed immediately and will continue until the position is filled.